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ASTM F1727-1997 standard practice for detection of oxidation induced defects in polished silicon wafers replaces f416-94

Standard Number:  ASTM F1727-1997
Title:  standard practice for detection of oxidation induced defects in polished silicon wafers replaces f416-94
Language:  English
Replaced by Standard:  ASTM F1727-02

Execute Date:  1997/6/10
Status:  Withdrawn
International Classification for Standards (ICS)ELECTRICAL ENGINEERING>>Semiconducting materials
Publisher:  American Society for Testing Material (ASTM)
Price:  
Number of Pages:3P.;A4  

Preface:   
Description:

1.1 This practice covers the detection of crystalline defects in the surface region of silicon wafers. The defects are induced or enhanced by oxidation cycles encountered in normal device processing. An atmospheric pressure, oxidation cycle representative of bipolar, metal-oxide-silicon (MOS) and CMOS technologies is included. This practice is required to reveal strain fields arising from the presence of precipitates, oxidation induced stacking faults, and shallow etch pits. Slip is also revealed that arises when internal or edge stresses are applied to the wafer.

1.2 Application of this practice is limited to specimens that have been chemical or chemical/mechanical polished to remove surface damage from at lease one side of the specimen. This practice may also be applied to detection of defects in epitaxial layers.

1.3 The surface of the specimen opposite the surface to be investigated may be damaged deliberately or otherwise treated for gettering purposes or chemically etched to remove damage.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

  
File Format:  PDF(Acrobat Reader) or Word version doc Document
File Size:  217KB
Tile in English:  standard practice for detection of oxidation induced defects in polished silicon wafers replaces f416-94

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