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JIS Z3284-4-2014 Solder paste -- Part 4: Test methods for wettability, solderball and spread

Standard Number:  JIS Z3284-4-2014
Title:  Solder paste -- Part 4: Test methods for wettability, solderball and spread
Language:  Japanese
Replacing Standard:  JIS Z 3284-1994 solder paste

Publication Date:  2014/6/20
Execute Date:  2014/6/20
Status:  Current
International Classification for Standards (ICS)MANUFACTURING ENGINEERING>>Welding, brazing and soldering>>Brazing and soldering
Publisher:  Japanese Standards Association (JSA JIS)
Price:  
Number of Pages:32  

Description:Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.  
Catalog:Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
Annex A (normative) - Characteristics evaluation table of
solder paste
Annex JA (informative) - Comparison table between JIS
and corresponding International Standard  
File Format:  PDF(Acrobat Reader) or Word version doc Document
File Size:  242KB
Tile in English:  Solder paste -- Part 4: Test methods for wettability, solderball and spread

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