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Search Home >> Standards Wordwide >> Cenelec Electronic Components Committee (CECC) >> CECC 23800-801-1998 Capability Detail Specification - Flexible Multilayer Printed Boards With Through Connections

CECC 23800-801-1998 Capability Detail Specification - Flexible Multilayer Printed Boards With Through Connections

Standard Number:  CECC 23800-801-1998
Title:  Capability Detail Specification - Flexible Multilayer Printed Boards With Through Connections
Language:  English
Status:  Current
International Classification for Standards (ICS)ELECTRONICS>>Printed circuits and boards
Publisher:  Cenelec Electronic Components Committee (CECC)
Price:  
Number of Pages:  

Description:Defines the Capability Qualifying Component (CQC), its characteristics for testing, test procedures and conditions for application, together with the requirements for fulfilment for testing basic and extended capability.  
Catalog:1 GENERAL
1.1 Scope
1.2 Object
2 CAPABILITY QUALIFYING COMPONENT
2.1 Materials
2.2 Surface finishes
2.2.1 Metallic finishes
2.2.1.1 Accelerated ageing
2.2.2 Organic finishes
2.3 Variant designation
3 CAPABILITY APPROVAL
3.1 Range of capability approval
3.2 QPL information
4 CAPABILITY TEST PROGRAMME
4.1 Capability demonstration
4.1.1 Other metallic surface finishes
4.1.2 Organic surface finishes
5 ADDITIONAL CAPABILITY
6 TRACEABILITY
Table I Capability Approval Test Schedule
Table IIa Additional metallic conductor finishes
Table IIb Additional contact finishes
Table III Permanent organic finishes
Annex A Edge connector imperfections
Annex B Circumferential defects in plated-through holes
  
File Format:  PDF(Acrobat Reader) or Word version doc Document
File Size:  933KB
Tile in English:  Capability Detail Specification - Flexible Multilayer Printed Boards With Through Connections

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